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Title: A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tin
Authors: Chen, Keming
Liu, Changqing
Whalley, David C.
Hutt, David A.
Li, Jianfeng
Mannan, Samjid H.
Keywords: Interface
Intermetallic compounds
Diffusion
Soldering
Issue Date: 2008
Publisher: Elsevier (© Acta Materialia Inc.)
Citation: CHEN, K. ... et al, 2008. A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tin. Acta Materialia, 56 (19), pp.5668-5676.
Abstract: A comparative study of the reaction characteristics between molten tin and both as-plated and heat-treated Ni-P coatings was carried out, with a specific focus on the stability of the Ni3P intermetallic layer and its effects on the subsequent reaction. It was found that a continuous layer of Ni3P may be formed on both types of Ni-P during the interfacial reaction, despite the fact that heat-treated Ni-P is a two-phase mixture of Ni3P and Ni. The Ni3P formed on the heat-treated Ni-P was thinner than that on as-plated Ni-P. A mass conservation analysis of P revealed that no or limited P was lost into the molten tin when the Ni3P layer was thin, whereas a significant loss of P took place as the Ni3P thickness increased. It is proposed that the Ni3P phase is stable and it may not undergo chemical decomposition during the interfacial reaction. The loss of P to the molten tin observed in the present study is most likely due to the crumbling of Ni3P particles into the liquid phase, as a result of the enhanced mass transport due to use of thin copper wire substrates rather than a planar surface. Finally, the results show that the Ni3P phase cannot act 2 as an effective barrier layer to the attack of molten tin toward the substrate. Defects in the Ni3P were found to allow localised penetration of molten tin.
Description: This is the author’s version of a work that was accepted for publication in Acta Materialia. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published at: http://dx.doi.org/10.1016/j.actamat.2008.07.035
Sponsor: This research was supported by the Engineering and Physical Science Research Council [Grant number GR/S87485/01] in collaboration with Dynex Semiconductor Ltd., TWI Ltd., Henkel Ltd. and Oxford Applied Technology Ltd.
Version: Accepted for publication
DOI: 10.1016/j.actamat.2008.07.035
URI: https://dspace.lboro.ac.uk/2134/13360
Publisher Link: http://dx.doi.org/10.1016/j.actamat.2008.07.035
ISSN: 1359-6454
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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