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Title: On the use of silver nanoparticles for direct micropatterning on polyimide substrates
Authors: Ng, Jack H.-G.
Watson, David E.G.
Sigwarth, Joachim
McCarthy, Aongus
Prior, Kevin A.
Hand, Duncan P.
Yu, Weixing
Kay, Robert W.
Liu, Changqing
Desmulliez, Marc P.Y.
Keywords: Metallization
Silver nanoparticles
Flexible substrate
Direct writing
Electroless plating
Issue Date: 2012
Publisher: © IEEE
Citation: NG, J.H.-G. ... et al, 2012. On the use of silver nanoparticles for direct micropatterning on polyimide substrates. IEEE Transactions on Nanotechnology, 11 (1), pp.139-147.
Abstract: This article proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV energy dose and heat treatment have to be traded off against photoand thermal degradation of the polymer substrate. Factors affecting the adhesion of the final electroless metal deposit are also discussed.
Description: © 2012. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Version: Accepted for publication
DOI: 10.1109/TNANO.2011.2160092
URI: https://dspace.lboro.ac.uk/2134/13403
Publisher Link: http://dx.doi.org/10.1109/TNANO.2011.2160092
ISSN: 1536-125X
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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