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|Title: ||On the use of silver nanoparticles for direct micropatterning on polyimide substrates|
|Authors: ||Ng, Jack H.-G.|
Watson, David E.G.
Prior, Kevin A.
Hand, Duncan P.
Kay, Robert W.
Desmulliez, Marc P.Y.
|Issue Date: ||2012|
|Publisher: ||© IEEE|
|Citation: ||NG, J.H.-G. ... et al, 2012. On the use of silver nanoparticles for direct micropatterning on polyimide substrates. IEEE Transactions on Nanotechnology, 11 (1), pp.139-147.|
|Abstract: ||This article proposes a direct micropatterning
process based on the growth of photoreduced silver
nanoparticles onto polyimide substrates. The silver
nanoparticles are found to have sufficient catalytic
efficiency for subsequent electroless plating.
Characterization of the process indicates that UV energy
dose and heat treatment have to be traded off against photoand
thermal degradation of the polymer substrate. Factors
affecting the adhesion of the final electroless metal deposit
are also discussed.|
|Description: ||© 2012. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.|
|Version: ||Accepted for publication|
|Publisher Link: ||http://dx.doi.org/10.1109/TNANO.2011.2160092|
|Appears in Collections:||Published Articles (Mechanical, Electrical and Manufacturing Engineering)|
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