BINDEL, A. ... et al, 2012. Product life cycle information management in the electronics supply chain. Proceedings of the Institution of Mechanical Engineers Part B - Journal of Engineering Manufacture, 226 (B8), pp.1388-1400.
Information availability and data transparency are key requirements from manufacturers when
supporting products throughout the life cycle, for example when implementing product service
systems. The application of embedded wireless technologies into printed circuit boards (PCBs) can
help bridging current knowledge gaps and to minimise both technical and financial risk through
reduced product downtime, improved quality of tracking and enhanced end-of-life decision
making. The application of embedded RFID into PCBs for life cycle monitoring of electronic
products to support Product Service Systems is discussed in this paper.
This article was accepted for publication in the journal Proceedings of the Institution of Mechanical Engineers Part B - Journal of Engineering Manufacture and the definitive version is available at: http://dx.doi.org/10.1177/0954405412448780