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|Title: ||Formation of Ag3Sn plates in SnAgCu solder bumps|
|Authors: ||Gong, Jicheng|
Conway, Paul P.
Silberschmidt, Vadim V.
|Issue Date: ||2010|
|Publisher: ||© Elsevier|
|Citation: ||GONG, J. ... et al, 2010. Formation of Ag3Sn plates in SnAgCu solder bumps. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 527 (10-11), pp.2588-2591.|
|Abstract: ||Special experiments are designed to obtain the solid reactants directly from a liquid
solder during phase transformation. Series of such tests performed throughout reflow,
which enables to investigate the entire formation process of intermetallic Ag3Sn plates out
of liquid SnAgCu solder bumps. The results show that Ag3Sn plates are formed first in the
middle of the cooling stage. In the plane, they have two preferable growth directions. By varying thermal conditions during reflow, the formation mechanism of these plates is
|Description: ||This is the author’s version of a work that was accepted for publication in Materials Science and Engineering A. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published at: http://dx.doi.org/10.1016/j.msea.2009.12.020|
|Version: ||Accepted for publication|
|Publisher Link: ||http://dx.doi.org/10.1016/j.msea.2009.12.020|
|Appears in Collections:||Published Articles (Mechanical, Electrical and Manufacturing Engineering)|
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