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Title: Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder
Authors: Gong, Jicheng
Liu, Changqing
Conway, Paul P.
Silberschmidt, Vadim V.
Keywords: Soldering
Eutectic solidification
Dendrite growths
Intermetallics
Issue Date: 2009
Publisher: © Elsevier
Citation: GONG, J. ... et al, 2009. Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder. Scripta Materialia, 61 (7), pp.682-685.
Abstract: The formation behaviour of grains and their components, including Sn dendrites, Cu6Sn5 and Ag3Sn intermetallic compounds (IMCs), in a SnAgCu alloy is investigated in an experiment, capable to obtain the solid reactants directly from the liquid solder during the liquid-to-solid phase transformation. The results show that Cu6Sn5 IMCs are formed first in a grain; then large Sn dendrites; fibre-like Ag3Sn IMCs are formed ahead of the β-Sn matrix in the coupling process generating eutectics.
Description: This is the author’s version of a work that was accepted for publication in Scripta Materialia. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published at: http://dx.doi.org/10.1016/j.scriptamat.2009.05.034
Version: Accepted for publication
DOI: 10.1016/j.scriptamat.2009.05.034
URI: https://dspace.lboro.ac.uk/2134/13467
Publisher Link: http://dx.doi.org/10.1016/j.scriptamat.2009.05.034
ISSN: 1359-6462
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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