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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/13516

Title: Degradation of adhesion strength within mini-modules during damp-heat exposure
Authors: Wu, Dan
Zhu, Jiang
Betts, Thomas R.
Gottschalg, Ralph
Keywords: Adhesion strength
Peel test
Damp heat
Adhesion degradation modelling
Issue Date: 2013
Publisher: © WIP Wirtschaft und Infrastruktur GmbH & Co Planungs KG
Citation: WU, D. ... et al., 2013. Degradation of adhesion strength within mini-modules during damp-heat exposure . IN: Helm, P. (ed.) Proceedings of the 28th EU PVSEC, Paris, France, 2013, 8pp.
Abstract: The degradation of adhesion strength between back-sheet and encapsulant due to moisture ingress was investigated for commercial crystalline silicon photovoltaic (PV) mini-modules. The damp-heat test originated from qualification test was carried out at five different temperature and humidity conditions (95oC/85% RH, 85oC/85% RH, 65oC/85% RH, 85oC/65% RH and 85oC/45% RH) to assess the impact of stress levels on test outcomes. The adhesion strength was measured by 90o peel tests, carried out at specified degradation intervals. Several visual defects were observed, including delamination, moisture ingress and bubble formation. The adhesion strength showed a stretched exponential decay with time and significant influences of test conditions was demonstrated. A humidity dose model was proposed by assuming micro-climates seen by the modules, i.e. surface relative humidity of the back-sheet as the driving factor for an Arrhenius based model using temperature as accelerating factor. The correlation between adhesion degradation and humidity dose was investigated and an exponential model was developed to represent this correlation with extracted activation energy (Ea) of 63kJ/mol. This supplies a potential model for the estimation of adhesion strength decay triggered out by humidity in dependence of the humidity conditions.
Description: This is a EU PVSEC conference paper. The definitive version is available from EU PVSEC Proceedings.
Version: Submitted for publication
URI: https://dspace.lboro.ac.uk/2134/13516
Publisher Link: http://www.eupvsec-proceedings.com/proceedings?fulltext=Degradation+of+adhesion+strength+&paper=22923
ISSN: 2196-100X
Appears in Collections:Conference Papers and Contributions (Mechanical, Electrical and Manufacturing Engineering)
Conference Papers and Contributions (CREST)

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