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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/14875

Title: A time-strain monitoring system fabricated via offset lithographic printing
Authors: Hay, Gareth I.
Southee, Darren J.
Evans, Peter S.A.
Harrison, David J.
Simpson, George
Wood, J.
Issue Date: 2009
Publisher: © IOP Publishing Ltd
Citation: HAY, G.I. ... et al, 2009. A time-strain monitoring system fabricated via offset lithographic printing. Smart Materials and Structures, 18 (1), 015015.
Abstract: This paper reports progress in the development of strain sensors fabricated using the conductive lithographic film (CLF) printing process. Strain sensitive structures printed via an unmodified offset lithographic printing press using a silver-loaded conductive ink have been deposited concurrently with circuit interconnect, to form an electronic smart packaging system. A system populated with surface mount technology (SMT) components has proven successful in interpreting and logging deformation incidences subjected to a package during testing. It is proposed that with further development such a system could be printed synchronously with packaging graphics using a single printing process to form an integrated time–strain monitoring system.
Description: This article is closed access.
Version: Published
DOI: 10.1088/0964-1726/18/1/015015
URI: https://dspace.lboro.ac.uk/2134/14875
Publisher Link: http://dx.doi.org/10.1088/0964-1726/18/1/015015
ISSN: 0964-1726
Appears in Collections:Closed Access (Design School)

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