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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/16118

Title: Microwave assisted processing of metal loaded inks and pastes for electronic interconnect applications
Authors: Qi, Siyuan
Keywords: Conductive adhesives
Copper nano inks
Microwave processing
Resin curing mechanisms
Sintering
Conductivity
Interconnects
Issue Date: 2014
Publisher: © S. Qi
Description: This thesis is restricted until 31st October 2016. A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy of Loughborough University.
Sponsor: Materials Research School (MRS), Loughborough University
URI: https://dspace.lboro.ac.uk/2134/16118
Appears in Collections:Closed Access PhD Theses (Materials)

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