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|Title: ||Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packaging|
|Authors: ||Wang, Jing|
Mortimer, Roger J.
Ashworth, Mark A.
|Issue Date: ||2014|
|Citation: ||WANG, J. ... et al, 2014. Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packaging. Presented at: 2014 ECS (The Electrochemical Society) and SMEQ (Sociedad Mexicana de Electroquímica) Joint International Meeting, 5th-9th October 2014, Cancun, Mexico, paper 1710.|
|Abstract: ||Electronics products are required to operate at high temperatures in various harsh environments, for instance in oil well, geophysical drilling and aerospace applications. Conventional solder interconnects that have been extensively utilised in consumer electronics are no longer adequate primarily due to excessive intermetallic compounds (IMCs) that can be formed and continuously grow during high temperature operation. With an intention of reducing such an excessive IMC growth, the introduction of electrically conducting niobium sub-oxide into the Ni coating which acts as a barrier layer between the solder and substrate may promise the possibility of developing a new solder barrier material with electrical conductivity and chemical resistance as required.|
|Description: ||This conference paper was presented at the 2014 ECS and SMEQ Joint International Meeting held in Cancun Mexico.|
|Version: ||Accepted for publication|
|Publisher Link: ||https://ecs.confex.com/ecs/226/webprogram/Paper37430.html|
|Appears in Collections:||Conference Papers and Presentations (Chemistry)|
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