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Title: Thin film thickness measurements using Scanning White Light Interferometry
Authors: Maniscalco, Bianca
Kaminski, Piotr M.
Walls, Michael
Keywords: Scanning White Light Interferometry
Coherence correlation interferometry
Thin film
Metrology
Thin film thickness
Surface roughness
Helical complex field
Ellipsometry
Issue Date: 2014
Publisher: Elsevier © the authors
Citation: MANISCALCO, B., KAMINSKI, P.M. and WALLS, J.M., 2014. Thin film thickness measurements using Scanning White Light Interferometry. Thin Solid Films, 550, pp. 10 - 16.
Abstract: Scanning White Light Interferometry is a well-established technique for providing accurate surface roughness measurements and three dimensional topographical images. Here we report on the use of a variant of Scanning White Light Interferometry called coherence correlation interferometry which is now capable of providing accurate thickness measurements from transparent and semi-transparent thin films with thickness below 1 μm. This capability will have many important applications which include measurements on optical coatings, displays, semiconductor devices, transparent conducting oxides and thin film photovoltaics. In this paper we report measurements of thin film thickness made using coherence correlation interferometry on a variety of materials including metal-oxides (Nb2O5 and ZrO2), a metal-nitride (SiNx:H), a carbon-nitride (SiCxNy:H) and indium tin oxide, a transparent conducting oxide. The measurements are compared with those obtained using spectroscopic ellipsometry and in all cases excellent correlation is obtained between the techniques. A key advantage of this capability is the combination of thin film thickness and surface roughness and other three-dimensional metrology measurements from the same sample area.
Description: This is an Open Access Article. It is published by Elsevier under the Creative Commons Attribution 3.0 Unported Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/3.0/
Sponsor: The authors are grateful to EPSRC and TSB for funding. We are also grateful to Mr Daniel Mansfield and his colleagues at Taylor Hobson Ltd for the collaboration in this study and for funding a studentship for Biancamaria Maniscalco.
Version: Published
DOI: 10.1016/j.tsf.2013.10.005
URI: https://dspace.lboro.ac.uk/2134/16504
Publisher Link: http://dx.doi.org/10.1016/j.tsf.2013.10.005
ISSN: 0040-6090
Appears in Collections:Published Articles (CREST)
Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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