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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/17072

Title: Adhesion of aerosol deposition traces targeted for flexible electronics applications
Authors: Lim, Ying Ying
Goh, Yee M.
Tsuda, Hiroki
Akedo, Jun
Aoyagi, Masahiro
Liu, Changqing
Issue Date: 2014
Publisher: National Institute of Advanced Industrial Science and Technology (AIST)
Citation: LIM, Y.Y. ... et al, 2014. Adhesion of aerosol deposition traces targeted for flexible electronics applications. Presented at: the Third International Conference on Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D-2014), 27th-28th August 2014, Ibaraki, Japan.
Abstract: •Emergence of wearable electronics - from medical to consumer products. •Requirement: To realise conductive traces on flexible substrates. •Common printing techniques: screen printing and inkjet printing. •Aerosol deposition (AD)1 is an emerging potential technology as it offers room temperature deposition. •From literature others have used AD to deposit metal base layers onto flexible substrates. To the authors’ best knowledge, there has been no work reported on the deposition of copper onto flexible substrates. •Copper is an attractive option as it is relatively cheap compared to other metals (eg. silver).
Description: This is a poster presentation.
Sponsor: This research was carried out as a collaboration between Loughborough University and AIST. The authors would like to acknowledge the 7th European Community Framework Programme for financial support through a Marie Curie International Research Staff Exchange Scheme (IRSES) Project entitled “Micro-Multi-Material Manufacture to Enable Multifunctional Miniaturised Devices (M6)” (Grant No. PIRSES-GA-2010-269113).
Version: Published
URI: https://dspace.lboro.ac.uk/2134/17072
Appears in Collections:Conference Papers and Contributions (Mechanical, Electrical and Manufacturing Engineering)

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