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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/17351

Title: Mechanical structures for smart-phone enabled sensing
Authors: Lawes, Simon
Kinnell, Peter
Keywords: Passive sensors
Moire fringe
Smart phones
Compliant mechanisms
Acoustic measurement
Issue Date: 2014
Publisher: International journal of Smart Sensing and Intelligent Systems
Citation: LAWES, S. and KINNELL, P., Mechanical structures for smart-phone enabled sensing. IN: Eighth International Conference on Sensing Technology (ICST 2014), Liverpool John Moores University, Liverpool, England, 2-4 September 2014, pp. 179-183.
Abstract: The paper presents a new strategy for sensor design that is made possible by the usage of ubiquitous mobile devices for signal capture, digitization, and data processing. The approach taken is to design simple mechanical sensor elements such that they produce a sensor output that is easily acquired by a mobile smart device such as a phone or tablet computer. To illustrate this concept, two mechanical displacement transducers have been designed and tested. These sensors make use of displacement amplification structures, Moiré pattern gratings and a double-ended-tuning-fork (DETF) resonant structure. The sensors produced either an acoustic or optical signal in response to an input load or displacement, which can then be acquired using the camera or microphone of a mobile device. The computing power and connectivity of mobile devices makes a wide range of processing, visualisation and storage techniques possible at low cost. Using this technique an optical displacement transducer with a range of 150 µm, and a resolution of <5 µm; and an acoustic displacement transducer with a range of 20 µm and a standard error of 0.14 µm, are demonstrated.
Description: This is a conference paper.
Version: Published
URI: https://dspace.lboro.ac.uk/2134/17351
Publisher Link: http://www.s2is.org/icst-2014/papers/1569989991.pdf
Appears in Collections:Conference Papers and Contributions (Mechanical, Electrical and Manufacturing Engineering)

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