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Title: Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition
Authors: Chen, Yuanming
Lin, Jianhui
Qiu, Tianyang
He, Wei
Silberschmidt, Vadim V.
Wang, Shouxu
Tan, Ze
Keywords: Electronic materials
Crystal growth
Microstructure
Issue Date: 2015
Publisher: © Elsevier
Citation: CHEN, Y. ... et al, 2015. Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition. Materials Letters, 139, pp. 458 - 461.
Abstract: Copper oxide was prepared with thermal decomposition of basic copper carbonate to complement the concentration of cupric ions for copper electrodeposition in a plating system with insoluble anode. Copper oxide particles with a structure of aggregated porous flakes had a wide size distribution ranging from 100 nm to 100 μm. Copper oxide exhibited a dissolution rate of about 15 s in 12.5 vol% H2SO4 solution. During copper electrodeposition, copper deposits with fine growth formed in the electrolyte with stable cupric concentration provided by rapid dissolution of copper oxide.
Description: This paper was accepted for publication in the journal Materials Letters and the definitive published version is available at http://dx.doi.org/10.1016/j.matlet.2014.10.080.
Sponsor: The authors gratefully acknowledge the support of Guangdong Innovative Research Team Program (No. 201301C0105324342), National Natural Science Foundation of China (No. 61474019) and Ph.D. Programs Foundation of Ministry of Education of China (No. 20120185110021), and we also express our sincere thanks to the support of China Scholarship Council (No. 201306070032).
Version: Accepted for publication
DOI: 10.1016/j.matlet.2014.10.080
URI: https://dspace.lboro.ac.uk/2134/17465
Publisher Link: http://dx.doi.org/10.1016/j.matlet.2014.10.080
ISSN: 0167-577X
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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