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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/19450

Title: Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition
Authors: Chen, Guang
Wu, Fengshun
Liu, Changqing
Silberschmidt, Vadim V.
Chan, Y.C.
Keywords: Ni-coated graphene oxide
Lead-free solder
Melting temperature
Mechanical properties
Raman spectrum
Issue Date: 2015
Publisher: © Elsevier
Citation: CHEN, G. ...et al., 2015. Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition. Journal of Alloys and Compounds, 656, pp. 500–509.
Abstract: This paper deals with microstructures and properties of SAC305 lead-free solder reinforced with graphene nanosheets (GNS) decorated with Ni nanoparticles (Ni-GNS). These Ni-coated GNS nanosheets were synthesized by an in-situ chemical reduction method. After morphological and chemical characterization, Ni-GNS were successfully integrated into SAC305 lead-free solder alloy with different weight fractions (0, 0.05, 0.1 and 0.2 wt.%) through a powder metallurgy route. The obtained composite solders were then studied extensively with regard to their microstructures, wettability, thermal, electrical and mechanical properties. After addition of Ni-GNSs, cauliflower-like (Cu,Ni)6 Sn5 intermetallic compounds (IMCs) were formed at the interface between composite solder joint and copper substrate. Additionally, blocky NieSneCu IMC/GNS hybrids were also observed homogenously distributed in the composite solder matrices. Composite solder alloys incorporating Ni-decorated GNSs nanosheets showed slightly reduced electrical resistivity compared to the unreinforced SAC305 solder alloy. With an increase in the amount of Ni-GNS, the composite solders showed an improvement in wettability with an insignificant change in their melting temperature. Mechanical tests demonstrated that addition of 0.2 wt.% Ni-GNS would result in 19.7% and 16.9% improvements in microhardness and shear strength, respectively, in comparison to the unreinforced solders. Finally, the added Ni-GNS reinforcements in the solder matrix were assessed with energy-dispersive X-ray spectroscopy, scanning electron microscopy and Raman spectroscopy.
Description: This paper was accepted for publication in the journal Journal of Alloys and Compounds and the definitive published version is available at http://dx.doi.org/10.1016/j.jallcom.2015.09.178
Sponsor: The authors acknowledge the research funding by the National Natural Science Foundation of China (NSFC) and The Research Grants Council (RGC) Joint Research project (NSFC NO. 61261160498, RGC NO. CityU101/12).
Version: Accepted for publication
DOI: 10.1016/j.jallcom.2015.09.178
URI: https://dspace.lboro.ac.uk/2134/19450
Publisher Link: http://dx.doi.org/10.1016/j.jallcom.2015.09.178
ISSN: 1873-4669
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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