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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/19452

Title: Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging
Authors: Chen, Zhiwen
Liu, Changqing
Wu, Yiping
An, Bing
Zhou, Longzao
Keywords: Lead-free solder
Intermetallic compounds
Height reduction of solder joints
Issue Date: 2015
Publisher: © The Minerals, Metals & Materials Society. Published by Springer.
Citation: CHEN, Z. ...et al., 2015. Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging. Journal of Electronic Materials, 44(11), pp. 4058-4064.
Abstract: Sn99Cu1/Cu solder joints were investigated after isothermal aging at 175°C for different lengths of time under vacuum conditions. The results revealed height reduction of the solder of approximately 1.2 μm after aging for 1132.5 h. This was primarily attributed to growth of a layer of interfacial intermetallic compounds. The reduction was measured by use of a copper block containing a recess filled with solder, which was reflowed then polished flat. Height reduction of the solder joint during aging was found to obey the parabolic law \(\Delta h = -\!\!\hbox{ }0.031\sqrt t\), and was in excellent agreement with theoretical calculation.
Description: This paper is in closed access.
Version: Published
DOI: 10.1007/s11664-015-3979-y
URI: https://dspace.lboro.ac.uk/2134/19452
Publisher Link: http://dx.doi.org/10.1007/s11664-015-3979-y
ISSN: 1543-186X
Appears in Collections:Closed Access (Mechanical, Electrical and Manufacturing Engineering)

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