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Cell integrated thin-film multi-junction thermocouple array for in-situ temperature monitoring of Solid Oxide Fuel Cells
conference contribution
posted on 2016-01-13, 12:17 authored by Manoj Prasanna Ranaweera, Indae Choi, Jung-Sik KimA thin-film multi-junction thermocouple array was developed and tested for multi-point simultaneous temperature measurements from an operating SOFC stack. The array requires only {N+1} number of wires/ thermo-elements for N number of independent temperature measuring points. Hence, it requires less number of lead wires than any available contact-temperature sensors require for the same number of measurements. Because the multi-junction thermocouple array operates on the same principle of a conventional thermocouple, the Seebeck effect, it shares all the merits of a thermocouple. A thin-film multi-junction thermocouple array was sputter deposited on the cathode of a SOFC test cell and tested and evaluated up to 10500C from 200C. Temperature measured from the thermocouple array was compared with that from a commercial thermocouple placed adjacent to it during the test; they were in very good agreement within the entire temperature range that a SOFC stack generally operates.
History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Aeronautical and Automotive Engineering
Published in
IEEE sensors 2015Citation
RANAWEERA, M.P, CHOI, I. and KIM, J.-S., 2015. Cell integrated thin-film multi-junction thermocouple array for in-situ temperature monitoring of Solid Oxide Fuel Cells. IN: Proceedings, IEEE Sensors 2015, November 1st-4th, Pusan, South Korea, pp.5-8Publisher
© IEEEVersion
- AM (Accepted Manuscript)
Publication date
2015Notes
© 2015 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to use any copyrighted component of this work in other works must be obtained from the IEEE.ISBN
9781479982028Publisher version
Language
- en