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The effect of laser remelting on the surface chemistry of Ti6al4V components fabricated by selective laser melting

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journal contribution
posted on 2016-02-25, 13:24 authored by Jayasheelan Vaithilingam, Ruth Goodridge, Richard J.M. Hague, Steven ChristieSteven Christie, Steve Edmondson
Surface remelting/skin scanning of components is generally performed during the selective laser melting (SLM) process to improve the surface quality of a part. However, the chemical effects of surface remelting are not well understood. In this study, cuboidal parts fabricated with and without laser remelting were characterised using scanning electron microscopy (SEM), surface profilometry and X-ray photoelectron spectrophotometry (XPS). The SEM images showed a low-amplitude undulating pattern was observed on both surfaces. The surface chemistries of the surface remelted/skin scanned (SK) and non-surface remelted/non-skin scanned (NSK) samples were observed to significantly differ in their elemental composition. The thickness of the surface oxide layer of the SK surface was double that of the NSK surface. Also, the contribution of the major alloying elements, including titanium and aluminium, on the surface oxide layer varied for both NSK and SK surfaces. The surface chemistry of the NSK and SK surface was significantly different to a conventionally forged (CF) Ti6Al4V surface. The rate of decrease of oxide with depth was in the order of CF > NSK > SK. Although surface remelting is useful in rendering improved surface quality, its impact on surface chemistry should be carefully considered.

Funding

This work was supported by the Engineering and Physical Sciences Research Council(EPSRC; UK) under grant EP/I033335/2.

History

School

  • Science

Department

  • Chemistry

Published in

Journal of Materials Processing Technology

Volume

232

Pages

1 - 8

Citation

VAITHILINGAM, J. ... et al, 2016. The effect of laser remelting on the surface chemistry of Ti6al4V components fabricated by selective laser melting. Journal of Materials Processing Technology, 232, pp. 1 - 8.

Publisher

Elsevier / © The Authors

Version

  • VoR (Version of Record)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution 4.0 International (CC BY 4.0) licence. Full details of this licence are available at: http://creativecommons.org/licenses/ by/4.0/

Publication date

2016

Notes

This is an open access article published by Elsevier under the CC BY license (http://creativecommons.org/licenses/by/4.0/).

ISSN

0924-0136

Language

  • en