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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/20462

Title: A novel current density distribution sensorfor use in parallel plate transmission lines
Authors: Omar, Kaashif A.M.
Graneau, N.
Novac, Bucur M.
Smith, Ivor R.
Issue Date: 2014
Publisher: IEEE
Citation: OMAR, K.A.M. ...et al., 2014. A novel current density distribution sensorfor use in parallel plate transmission lines. Presented at the 17th International Symposium on Electromagnetic Launch Technology (EML), La Jolla, CA., 7-11th July.
Abstract: As part of an on-going electromagnetic flyer plate research programme, it has been established that a method to determine the current distribution (or at least confirm its uniformity) is now required to establish predictable acceleration of the flyer plate. To achieve this diagnostic capability, a bespoke sensor array has been developed, termed the MIDOT (a relative Mutual Inductance sensor array). It has been specifically developed as a method of determining the current density distribution across a thin, close coupled, parallel plate transmission line. This novel sensor has been developed to a point where the proof of principle has been successfully demonstrated on a low voltage test bed, with some preliminary high voltage shots being carried out on a bespoke experimental arrangement prior to it being fielded on the flyer plate accelerator facilities at both Loughborough University and AWE.
Description: Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Version: Accepted for publication
DOI: 10.1109/EML.2014.6920696
URI: https://dspace.lboro.ac.uk/2134/20462
Publisher Link: http://dx.doi.org/10.1109/EML.2014.6920696
Appears in Collections:Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)

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