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Title: A wavelet analysis on digital microstructure in microbumps
Authors: Huang, Zhiheng
Lv, Hao
Conway, Paul P.
Issue Date: 2015
Publisher: © IEEE
Citation: HUANG, Z., LV, H. and CONWAY, P.P., 2015. A wavelet analysis on digital microstructure in microbumps. Presented at the 16th International Conference on Electronic Packaging Technology, (ICEPT 2015), Changsha, China, 11-14 Aug., pp. 359-366.
Abstract: © 2015 IEEE. Heterogeneous three-dimensional system integration is the ultimate goal for packaging and integration, where materials are pushed to their physical limits. In this context, the microstructure of packaging materials, which exhibits a multi-scale nature, will be carefully designed and tightly controlled in both manufacturing and in-service conditions to ensure long-term reliability of the electronic products. A multi-level discrete wavelet transform using the haar wavelet is conducted on the dendritic structures, simulated with a phase field model, during solidification in microbumps with different sizes and geometries. The statistical data, e.g. the mean, standard deviation and energy, of the detail coefficients from the wavelet analysis reveal a wealthy of information on the features of the dendritic structure and its evolution during solidification at multiple resolutions. The size and geometry effects on the microstructure formed in the microbumps can thus be quantified by such data. Further studies using techniques such as principle component analysis and Radon transform can be conducted to evaluate the consistence of the result.
Description: This is a conference paper [© IEEE]. It is also available from: http://dx.doi.org/10.1109/ICEPT.2015.7236608. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Sponsor: This work was supported by the Pearl River Science and Technology Nova Program of Guangzhou under Grant 2012J2200074 and the National Natural Science Foundation of China (NSFC) under Grant 51004118.
Version: Accepted for publication
DOI: 10.1109/ICEPT.2015.7236608
URI: https://dspace.lboro.ac.uk/2134/20645
Publisher Link: http://dx.doi.org/10.1109/ICEPT.2015.7236608
ISBN: 9781467379991
Appears in Collections:Conference Papers and Contributions (Mechanical, Electrical and Manufacturing Engineering)

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