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Title: Deposition and application of electroless Ni–W–P under bump metallisation for high temperature lead-free solder interconnects
Authors: Liu, Li
Keywords: Electroless Ni-W-P deposition
Crystallisation characteristics
Lead-free high temperature solders
Diffusion barrier characteristics
Power electronics
Interfacial reactions
Issue Date: 2016
Publisher: © Li Liu
Abstract: A reliable and robust diffusion barrier, commonly known as under bump metallisation (UBM), is indispensable in solder interconnects in order to retard the interfacial reaction rate, hence the growth of intermetallic compounds (IMCs). However, electroless Ni-P coatings are not adequate to inhibit interfacial reactions effectively since the formation of columnar structure and voids in the crystalline Ni3P layer in hybrid automotive devices (operating temperature above 300ºC) can significantly deteriorate the mechanical integrity of solder joints. In this thesis, electroless Ni-W-P coatings, as an effective UBM capable to serving under high temperature (up to 450ºC), are developed, characterised and subsequently applied onto the high temperature lead-free solder interconnects. [Continues.]
Description: A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy of Loughborough University.
Sponsor: Loughborough University.
URI: https://dspace.lboro.ac.uk/2134/23260
Appears in Collections:PhD Theses (Mechanical, Electrical and Manufacturing Engineering)

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