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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/23260

Title: Deposition and application of electroless Ni-W-P under bump metallisation for high temperature lead-free solder interconnects
Authors: Liu, Li
Keywords: Electroless Ni-W-P deposition
Crystallisation characteristics
Lead-free high temperature solders
Diffusion barrier characteristics
Power electronics
Interfacial reactions
Issue Date: 2016
Publisher: © Li Liu
Description: This Thesis is confidential until 01/11/2018. A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy of Loughborough University.
Sponsor: Loughborough University.
URI: https://dspace.lboro.ac.uk/2134/23260
Appears in Collections:Closed Access PhD Theses (Mechanical, Electrical and Manufacturing Engineering)

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