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|Title: ||Laser processing of printed copper interconnects on polymer substrates|
|Authors: ||Wu, Kang|
Hutt, David A.
Tyrer, John R.
Whalley, David C.
|Issue Date: ||2017|
|Publisher: ||© IEEE|
|Citation: ||WU, K. ... et al, 2017. Laser processing of printed copper interconnects on polymer substrates. 18th Electronics Packaging Technology Conference (EPTC 2016), Suntec City, Singapore, 30th November - 3rd December 2016, pp. 834-839.|
|Abstract: ||With the increasing demand for integration of electronics embedded within devices there has been a consequent increase in the requirement for the deposition of electrically conductive materials to form connecting tracks on or within non-traditional substrate materials, such as temperature sensitive polymers, that may also have non-planar surfaces. In this work, micron scale copper powder based materials were deposited onto acrylic and glass substrates and then selectively laser processed to form electrically conductive copper tracks. Before deposition, the copper powder was chemically treated to remove the surface oxide and subsequently protected with a self-assembled monolayer coating. The copper was then patterned onto the substrate either as a dry powder confined within pre-formed grooves, or was combined with a binder to be printed as a paste. A CO2 laser was then used to heat the copper powder in air, leading to tracks that showed good electrical conductivity. At low laser power levels, the tracks appeared largely unchanged from the original material, but showed measureable conductivity. With higher laser power levels the tracks showed evidence of partial melting of the surface layers and further reductions in resistivity, to values approximately 30 times those of bulk copper, were obtained.|
|Description: ||© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.|
|Version: ||Accepted for publication|
|Publisher Link: ||https://www.ieee.org/index.html|
|Appears in Collections:||Closed Access (Mechanical, Electrical and Manufacturing Engineering)|
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