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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/23605

Title: Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability
Authors: Chen, Yuanming
Wang, Shouxu
He, Xuemei
He, Wei
Silberschmidt, Vadim V.
Tan, Ze
Keywords: Reliability
Thermal simulation
Copper coin
Heat dissipation
Issue Date: 2015
Publisher: © Emerald Group Publishing Limited
Citation: CHEN, Y. ... et al, 2015. Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability. Circuit World, 41 (2), pp. 55-60.
Abstract: Purpose - The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation. Design/methodology/approach - Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB. Findings - The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing. Originality/value - The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry.
Description: This paper was accepted for publication in the journal Circuit World and the definitive published version is available at http://dx.doi.org/10.1108/CW-11-2014-0052.
Sponsor: The authors gratefully acknowledge the support of Guangdong Innovative Research Team Program (no. 201301C0105324342), National Natural Science Foundation of China (no. 61474019) and also express their sincere thanks to the support of the China Scholarship Council (no. 201306070032).
Version: Accepted for publication
DOI: 10.1108/CW-11-2014-0052
URI: https://dspace.lboro.ac.uk/2134/23605
Publisher Link: http://dx.doi.org/10.1108/CW-11-2014-0052
ISSN: 0305-6120
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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