KUMAR, P. ...et al., 2017. Microstructural and reliability issues of TSV. IN: Li, Y. and Goyal, D. (eds.) 3D Microelectronic Packaging From Fundamentals to Applications, New York: Springer, pp. 71-100.
Springer Series in Advanced Microelectronics;57
3D microelectronic packaging is the industry trend to meet the ever-increasing market demand for increased performance, lower power, smaller footprint, lower cost, and integration of heterogeneous devices. Chapters 1 and 2 have discussed ...