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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/24160

Title: Microstructural and reliability issues of TSV
Authors: Kumar, Praveen
Dutta, Indranath
Huang, Zhiheng
Conway, Paul P.
Keywords: Technology & Engineering
Issue Date: 2017
Publisher: © Springer
Citation: KUMAR, P. ...et al., 2017. Microstructural and reliability issues of TSV. IN: Li, Y. and Goyal, D. (eds.) 3D Microelectronic Packaging From Fundamentals to Applications, New York: Springer, pp. 71-100.
Series/Report no.: Springer Series in Advanced Microelectronics;57
Abstract: 3D microelectronic packaging is the industry trend to meet the ever-increasing market demand for increased performance, lower power, smaller footprint, lower cost, and integration of heterogeneous devices. Chapters 1 and 2 have discussed ...
Description: This book chapter is in closed access.
Version: Accepted for publication
DOI: 10.1007/978-3-319-44586-1_4
URI: https://dspace.lboro.ac.uk/2134/24160
Publisher Link: http://dx.doi.org/10.1007/978-3-319-44586-1_4
ISBN: 3319445863
Appears in Collections:Closed Access (Mechanical, Electrical and Manufacturing Engineering)

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