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Microstructural and reliability issues of TSV

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posted on 2017-02-17, 11:18 authored by Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul ConwayPaul Conway
3D microelectronic packaging is the industry trend to meet the ever-increasing market demand for increased performance, lower power, smaller footprint, lower cost, and integration of heterogeneous devices. Chapters 1 and 2 have discussed ...

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

3D Microelectronic Packaging From Fundamentals to Applications Springer Series in Advanced Microelectronics

Volume

57

Pages

71 - 100 (461)

Citation

KUMAR, P. ...et al., 2017. Microstructural and reliability issues of TSV. IN: Li, Y. and Goyal, D. (eds.) 3D Microelectronic Packaging From Fundamentals to Applications, New York: Springer, pp. 71-100.

Publisher

© Springer

Version

  • AM (Accepted Manuscript)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2017

Notes

This book chapter is in closed access.

ISBN

3319445863;9783319445861

Book series

Springer Series in Advanced Microelectronics;57

Language

  • en

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