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|Title: ||Compressed sensing current mapping spatial characterization of photovoltaic devices|
|Authors: ||Koutsourakis, George|
Hall, Simon R.G.
Betts, Thomas R.
|Keywords: ||Light beam induced current measurements|
|Issue Date: ||2017|
|Publisher: ||© Crown Copyright. Published by IEEE|
|Citation: ||KOUTSOURAKIS, G. ...et al., 2017. Compressed sensing current mapping spatial characterization of photovoltaic devices. IEEE Journal of Photovoltaics, In Press.|
|Abstract: ||A new photovoltaic (PV) device current mapping method has been developed, combining the recently introduced Compressed Sensing (CS) sampling theory with Light Beam Induced Current (LBIC) measurements. Instead of a raster scan, compressive sampling is applied using a Digital Micro-mirror Device (DMD). The aim is to significantly reduce the time required to produce a current map, compared to conventional LBIC measurements. This is achieved by acquiring fewer measurements than a full raster scan and by utilizing the fast response of the micro-mirror device to modulate measurement conditions. The method has been implemented on an optical current mapping setup built at the National Physical Laboratory (NPL) in the UK. Measurements with two different PV cells are presented in this work and an analytical description for realisation of an optimised CS current mapping system is provided. The experimental results illustrate the feasibility of the method and its potential to significantly reduce measurement time of current mapping of PV devices.|
|Description: ||Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.|
|Sponsor: ||This work was funded through the European Metrology Research Programme (EMRP) Project ENG55 PhotoClass, which is jointly funded by the EMRP participating countries within EURAMET and the European Union.|
|Version: ||Accepted for publication|
|Publisher Link: ||http://dx.doi.org/10.1109/JPHOTOV.2016.2646900|
|Appears in Collections:||Published Articles (Mechanical, Electrical and Manufacturing Engineering)|
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