EMPS8 D Haspel et al Presentation.pdf (3.66 MB)
The use of post-electroplating surface modification treatments to mitigate tin whisker growth
conference contribution
posted on 2017-07-21, 14:16 authored by Dan Haspel, Mark Ashworth, Geoffrey Wilcox, Xujin BaoXujin BaoThe use of post-electroplating surface modification treatments to mitigate tin whisker growth
Funding
The authors would like to thank both the UK EPSRC Innovative Electronics Manufacturing Research Centre for funding this research through the WHISKERMIT programme and the Loughborough University Materials Research School.
History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Materials
Published in
8th Electronic Materials and Processes for Space (EMPS) WorkshopCitation
HASPEL, D. ... et al, 2017. The use of post-electroplating surface modification treatments to mitigate tin whisker growth. Presented at: Electronic Materials and Processes for Space (EMPS) Workshop, EMPS-8, ESA/ESTEC, Noordwijk, The Netherlands, 10th-12th May 2017.Publisher
EMPSVersion
- VoR (Version of Record)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Acceptance date
2017-03-20Publication date
2017Notes
This is a PowerPoint presentation.Language
- en