Loughborough University
Leicestershire, UK
LE11 3TU
+44 (0)1509 263171
Loughborough University

Loughborough University Institutional Repository

Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/26831

Title: A method for quantification of the effects of size and geometry on the microstructure of miniature interconnects
Authors: Xiong, Hua
Huang, Zhiheng
Conway, Paul P.
Keywords: Heterogeneous microstructure
Quantitative characterization
Size and geometry effects
Mechanical behavior
Phase field method
Ultrafine interconnects
Issue Date: 2013
Publisher: Springer © TMS
Citation: XIONG, H., HUANG, Z. and CONWAY, P.P., 2013. A method for quantification of the effects of size and geometry on the microstructure of miniature interconnects. Journal of Electronic Materials, 43 (2), pp. 618-629.
Abstract: Because the heterogeneity of microstructure has significant effects on the material properties of ultrafine interconnects, it should be quantified, to facilitate high-fidelity prediction of reliability. To address this challenge, a method based on autocorrelation and singular value decomposition is proposed for quantitative characterization of microstructure. The method was validated by developing a quantitative relationship between reported microstructure and tensile strength for SnAgCuRE solders reported in the literature. The method was used to study the effects of size and geometry in ultrafine Sn37Pb interconnects on microstructure and von Mises stress, which were obtained simultaneously by coupling a phase-field model with an elastic mechanical model. By use of this method the degree of heterogeneity of the microstructure in relation to preferred growth directions of the phases was quantified by use of a scalar microstructure index. It was found that microstructure heterogeneity increases with decreasing standoff height, and is higher for hourglass-shaped solder joints. The average von Mises stress was found to be positively related to the microstructure index. The strong correlation between microstructure index and average von Mises stress was confirmed by nonlinear regression analysis using an artificial neural network. This indicates that the mechanical behavior of ultrafine interconnects can be predicted more accurately on the basis of the microstructure index.
Description: The final publication is available at link.springer.com via http://dx.doi.org/10.1007/s11664-013-2907-2.
Sponsor: The authors wish to acknowledge financial support from the National Natural Science Foundation of China (NSFC) under grant no. 51004118, the Pearl River New Science Star Program of Guangzhou under grant no. 2012J2200074, the Scientific Research Foundation for Returned Overseas Chinese Scholars, State Education Ministry (SYSU internal grant no. 30000-4105346).
Version: Accepted for publication
DOI: 10.1007/s11664-013-2907-2
URI: https://dspace.lboro.ac.uk/2134/26831
Publisher Link: https://doi.org/10.1007/s11664-013-2907-2
ISSN: 0361-5235
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

Files associated with this item:

File Description SizeFormat
Pre-print accepted text.pdfAccepted version15.32 MBAdobe PDFView/Open


SFX Query

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.