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Title: A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
Authors: Iyer, Mahadevan K.
Issue Date: 1994
Publisher: © Mahadevan Krishna Iyer
Abstract: Multi-Chip Modules (MCMs) are considered as the next major step in the evolution of high performance microelectronic packaging. Advances in the performance of very high speed MCMs are limited by problems associated with interconnecting devices using metallic interconnects within the module. The need for faster interconnects for gigabit logic MCMs has been discussed in this thesis. Techniques to avoid the problem of taking high speed interconnections through multilayer substrates include radiative and optical techniques. The present research work concentrates on a radiative interconnection technique. [Continues.]
Description: A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.
Sponsor: Loughborough University (John Guest Philips Travelling Scholarship). Commonwealth Commission. British Council. India, Ministry of Human Resources and Development.
URI: https://dspace.lboro.ac.uk/2134/27246
Appears in Collections:PhD Theses (Mechanical, Electrical and Manufacturing Engineering)

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