Multi-Chip Modules (MCMs) are considered as the next
major step in the evolution of high performance
microelectronic packaging. Advances in the performance
of very high speed MCMs are limited by problems
associated with interconnecting devices using metallic
interconnects within the module. The need for faster
interconnects for gigabit logic MCMs has been
discussed in this thesis. Techniques to avoid the
problem of taking high speed interconnections through
multilayer substrates include radiative and optical
techniques. The present research work concentrates on
a radiative interconnection technique. [Continues.]
A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.
Loughborough University (John Guest Philips Travelling Scholarship). Commonwealth Commission. British Council. India, Ministry of Human Resources and Development.