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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/27476

Title: Influence of viscoelastic properties of encapsulation materials on the thermomechanical behavior of photovoltaic modules
Authors: Owen-Bellini, Michael
Montiel-Chicharro, Daniel
Zhu, Jiang
Betts, Thomas R.
Gottschalg, Ralph
Keywords: Durability
Finite element
Polymer characterization
Photovoltaic (PV) modules
Solder bond fatigue
Issue Date: 2018
Publisher: Institute of Electrical and Electronics Engineers
Citation: OWEN-BELLINI, M. ... et al., 2018. Influence of viscoelastic properties of encapsulation materials on the thermomechanical behavior of photovoltaic modules. IEEE Journal of Photovoltaics, 8(1), pp. 183-188.
Abstract: In this work, the mechanical properties of encapsulation materials for photovoltaic modules have been studied. A finite element model has been developed to simulate the degradation of solder bonds within modules subjected to different environmental conditions. Various polymeric encapsulants are characterized using constitutive techniques and included in the model. It is shown that the degradation rates of the solder bonds are dependent on the behavior of the encapsulant and that some encapsulants may cause higher or lower degradation than others depending on the use-environment.
Description: This article was published in the IEEE Journal of Photovoltaics [© IEEE] and the definitive version is available at: https://doi.org/10.1109/JPHOTOV.2017.2762583
Sponsor: This work was supported by the STAPP (EP/H040331/1) and JUICE (EP/P003605/1) projects
Version: Accepted for publication
DOI: 10.1109/JPHOTOV.2017.2762583
URI: https://dspace.lboro.ac.uk/2134/27476
Publisher Link: https://doi.org/10.1109/JPHOTOV.2017.2762583
ISSN: 2156-3381
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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