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Title: Adhesion toughness of multilayer graphene films
Authors: Wood, Joseph D.
Harvey, Christopher M.
Wang, Simon
Keywords: Characterization and analytical techniques
Graphene
Mechanical and structural properties and devices
Theory and computation
Issue Date: 2017
Publisher: Nature Publishing Group © The Author(s)
Citation: WOOD, J.D., HARVEY, C.M. and WANG, S., 2017. Adhesion toughness of multilayer graphene films. Nature Communications, 8, 1952.
Abstract: Interface adhesion toughness between multilayer graphene films and substrates is a major concern for their integration into functional devices. Results from the circular blister test, however, display seemingly anomalous behaviour as adhesion toughness depends on number of graphene layers. Here we show that interlayer shearing and sliding near the blister crack tip, caused by the transition from membrane stretching to combined bending, stretching and through-thickness shearing, decreases fracture mode mixity GII/GI, leading to lower adhesion toughness. For silicon oxide substrate and pressure loading, mode mixity decreases from 232% for monolayer films to 130% for multilayer films, causing the adhesion toughness Gc to decrease from 0.424 J m−2 to 0.365 J m−2. The mode I and II adhesion toughnesses are found to be GIc = 0.230 J m−2 and GIIc = 0.666 J m−2, respectively. With point loading, mode mixity decreases from 741% for monolayer films to 262% for multilayer films, while the adhesion toughness Gc decreases from 0.543 J m−2 to 0.438 J m−2.
Description: This is an Open Access Article. It is published by Nature Publishing Group under the Creative Commons Attribution 4.0 International Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/4.0/
Sponsor: This work was supported by the UK Engineering and Physical Sciences Research Council (EPSRC) under grant reference EP/M000958/1.
Version: Published
DOI: 10.1038/s41467-017-02115-w
URI: https://dspace.lboro.ac.uk/2134/27707
Publisher Link: https://doi.org/10.1038/s41467-017-02115-w
Appears in Collections:Published Articles (Aeronautical and Automotive Engineering)

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