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|Title: ||Experimental study of a flexible and environmentally stable electroadhesive device|
|Authors: ||Guo, Jianglong|
Bingham, Paul A.
Petzing, Jon N.
Jackson, Michael R.
|Issue Date: ||2017|
|Publisher: ||AIP Publishing © Author(s).|
|Citation: ||GUO, J. ... et al, 2017. Experimental study of a flexible and environmentally stable electroadhesive device. Applied Physics Letters, 111 (25), 251603.|
|Abstract: ||Electroadhesion is a promising adhesion mechanism for robotics and material handling applications due to several distinctive advantages it has over existing technologies. These advantages include enhanced adaptability, gentle/flexible handling, reduced complexity, and ultra-low energy consumption. Unstable electroadhesive forces, however, can arise in ambient environments. Electroadhesive devices that can produce stable forces in changing environments are thus desirable. In this study, a flexible and environmentally stable electroadhesive device was designed and manufactured by conformally coating a layer of barium titanate dielectric on a chemically etched thin copper laminate. The results, obtained from an advanced electroadhesive "normal force" testing platform, show that only a relative difference of 5.94% in the normal force direction was observed. This was achieved when the relative humidity changed from 25% to 53%, temperature from 13.7 °C to 32.8 °C, and atmospheric pressure from 999 hPa to 1016.9 hPa. This environmentally stable electroadhesive device may promote the application of the electroadhesion technology.|
|Description: ||This is an Open Access Article. It is published by AIP Publishing under the Creative Commons Attribution 4.0 International Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/4.0/|
|Sponsor: ||The authors acknowledge support from the EPSRC Centre for Innovative Manufacturing in Intelligent Automation, under Grant Reference No. EP/IO33467/1, and support from Innovate UK under Project Reference No. 101549.|
|Publisher Link: ||https://doi.org/10.1063/1.4995458|
|Appears in Collections:||Published Articles (Mechanical, Electrical and Manufacturing Engineering)|
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