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Title: Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy
Authors: Zhou, Zhaoxia
Liu, Li
Liu, Changqing
Keywords: Thermal stability
High temperature Pb-free solder
Zn-Al solder
In-situ electron microscopy
Issue Date: 2018
Publisher: © IEEE
Citation: ZHOU, Z., LIU, L. and LIU, C., 2018. Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy. Presented at the 2018 7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 18-21 September 2018.
Abstract: The present investigation aimed to use in-situ heating experiment in a transmission electron microscope (TEM) to live characterize the thermal stability of a Cu/Ni-W-P interlayer/ZnAl solder interconnect. It demonstrated the TEM was able to detect live intermetallic compounds (IMCs) growth during heating. In addition, stress building up was evidenced by the progressive evolving of the dislocations at the interface between NiW-P interlayer and the ZnAl Solder. However, due to the μm to nm scale of specimens' dimensions required for electron microscopy, the sample preparation and data interpretation remains a challenge.
Description: © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Sponsor: This work is supported by UK EPSRC Underpinning Power Electronics 2017: Heterogeneous Integration (EP/R004501/1), 2017-2020.
Version: Accepted for publication
DOI: 10.1109/ESTC.2018.8546440
URI: https://dspace.lboro.ac.uk/2134/36948
Publisher Link: https://doi.org/10.1109/ESTC.2018.8546440
ISBN: 9781538668146
Appears in Collections:Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)
Conference Papers and Presentations (Materials)

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