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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/3746

Title: 3D study of thermal stresses in lead-free surface mount devices
Authors: Hegde, Pradeep
Whalley, David C.
Silberschmidt, Vadim V.
Keywords: Lead-free solder
Surface mount device
Temperature distribution
Thermal stresses
Creep
Issue Date: 2008
Publisher: © Taylor & Francis
Citation: HEGDE, P., WHALLEY, D. and SILBERSCHMIDT, V.V., 2008. 3D study of thermal stresses in lead-free surface mount device. Journal of Thermal Stresses, 31 (11), pp. 1039-1055.
Abstract: The paper presents the study of non-uniform temperature distributions in a flip chip electronic assembly, and the use of these temperature distributions to analyse the thermal stresses in lead-free solder joints in surface mount devices. The thermal stresses in the solder joints are mainly due to the mismatch in the coefficients of thermal expansions between the component and substrate materials, and temperature gradient in the electronic assembly. The thermo-elasto-visco-plastic finite element analysis is carried out to investigate the extent of thermal stresses induced in solder joints between a surface mount component and a FR4 circuit board (substrate) under conditions of thermal cycling with the chip resistor operating at its full power condition. Three different cases of spatial temperature distributions are considered including one with an experimentally obtained non-uniform temperature distribution. A comparative study of thermal stresses is performed using a near-eutectic SnAgCu solder material for three different thermal cases.
Description: This is journal article was published in the Journal of Thermal Stresses [© Taylor & Francis] and the definitive version is available at: http://dx.doi.org/10.1080/01495730802250763
Version: Accepted for publication
DOI: 10.1080/01495730802250763
URI: https://dspace.lboro.ac.uk/2134/3746
ISSN: 0149-5739
1521-074X
Appears in Collections:Published Articles (Mechanical and Manufacturing Engineering)

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