HEGDE, P. ... et al, 2008. Finite element analysis of lead-free surface mount devices. Computational Materials Science, 43 (10), pp.212-220.
Transition to lead-free solder materials has raised concerns over the reliability of lead-free
solder joints in the electronic industry. Solder joints provide electrical conduction and
mechanical support for components and may operate over temperature extremes of -55oC to
125oC or greater. These temperatures are relatively high the melting point of the solder. A
mismatch between coefficients of thermal expansion of the component, solder and substrate,
combined with thermal variations during service, results in thermal fatigue that is a common
failure mechanism for solder joints in electronic products. So far most of the studies of this
issue have considered uniform temperature distributions in the electronic assembly. The main
objective of this paper is to investigate the effect of the experimentally observed non-uniform
temperature distribution in the electronic device on the structural response of solder joints in
comparison with that for a uniform temperature distribution.