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Title: Mesomechanical modelling of SnAgCu solder joints in flip chip
Authors: Gong, Jicheng
Liu, Changqing
Conway, Paul P.
Silberschmidt, Vadim V.
Keywords: SnAgCu solder
Crystal mechanics
Flip chip
Finite elements
Issue Date: 2008
Publisher: © Elsevier
Citation: GONG, J. ... et al, 2008. Mesomechanical modelling of SnAgCu solder joints in flip chip. Computational Materials Science, 43 (1), pp. 199 -211 [doi:10.1016/j.commatsci.2007.07.039]
Abstract: In modern microelectronic packages (considered here as a mesoscale), the size of microstructural features of an alloy is compatible with the scale of an entire element that can contain only one or a few grains. In this case, the mechanical behaviour of the element deviates from isotropic/homogenous character at the macroscopic scale of a bulk specimen, comprising a large number of randomly oriented grains. Generally, a crystal-plasticity model, which is based on dislocation sliding in certain slip systems, is applied to describe a local lattice-induced anisotropic behaviour. However, even at a room temperature, the movement of dislocations is not a single mechanism of the inelastic behaviour of eutectic SnAgCu solder due to its low melting point. Under a low-magnitude loading condition, creep also has an effect due to a movement of vacancies. At high temperatures, this creep can become a dominant mechanism for the inelastic behaviour, diminishing the role of the crystal-plasticity model. This paper accounts for the creep component of deformation and unites it with the traditional crystal-plasticity model. In addition, deformation due to thermal expansion is introduced into the constitutive equation to capture the major mechanisms of the mechanical behaviour of a SnAgCu solder micro-joint used in electronics.
Description: This is a journal article. It was published in the journal, Computational Materials Science [© Elsevier] and the definitive version is available at: http://www.sciencedirect.com/science/journal/09270256
URI: https://dspace.lboro.ac.uk/2134/3751
ISSN: 0927-0256
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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