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|Title: ||Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment|
|Authors: ||Ogunjimi, Adebayo Oluyinka|
Mannan, Samjid H.
Whalley, David C.
Williams, David J.
|Keywords: ||Anisotropic Conducting Adhesive|
|Issue Date: ||1996|
|Publisher: ||© Institute of Electrical and Electronics Engineers (IEEE)|
|Citation: ||OGUNJIMI, A. O. ...et al, 1996. Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment. IEEE transactions on components, packaging and manufacturing technology - Part C, 19 (4), pp. 257-263|
|Abstract: ||This paper presents new results from an experimental
and theoretical program to evaluate relevant process
parameters in the assembly of a 500 m pitch area array component
using anisotropic conductive adhesive (ACA) materials.
This experimental configuration has features of micro ball grid
array ( BGA), chip scale packaging (CSP), and also flip-chip
and conventional ball grid array (BGA) package structures. A
range of materials combinations have been evaluated, including
(random filled) adhesive materials based on both thermoplastic
and thermosetting resin systems, combined with both organic and
thick-film on ceramic substrate materials. The ACA’s used have
all been applied as films, and hence are also known as anisotropic
conducting films (ACF).
The test assemblies have been constructed using a specially
developed instrumented assembly system which allows the measurement
of the process temperatures and pressures and the
consequent bondline thickness reduction and conductivity development.
The effects of the process parameters on the resulting
properties, particularly conductivity and yield, are reported.
A complementary paper  indicates the results of computational
fluid dynamics (CFD) models of the early stages of the
assembly process which allow the extrapolation of the present
results to finer pitch geometries.|
|Description: ||This is a journal article. It was published in the journal IEEE transactions on components, packaging and manufacturing technology - Part C [© IEEE], and is available from: http://ieeexplore.ieee.org/servlet/opac?punumber=3476 . Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Published Articles (Mechanical, Electrical and Manufacturing Engineering)|
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