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|Title: ||Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory|
|Authors: ||Mannan, Samjid H.|
Whalley, David C.
Ogunjimi, Adebayo Oluyinka
Williams, David J.
|Keywords: ||Anisotropic Conductive Adhesive,|
Computational Fluid Dynamics
|Issue Date: ||1996|
|Publisher: ||© Institute of Electrical and Electronics Engineers (IEEE)|
|Citation: ||MANNAN, S. H. ...et al, 1996. Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory. IEEE transactions on components, packaging and manufacturing technology - Part C, 19 (4), pp. 264-269|
|Abstract: ||This paper presents new results from an experimental
and theoretical program to evaluate relevant process
parameters in the assembly of a 500 m pitch area array component
using anisotropic conductive adhesive (ACA) materials.
This experimental configuration has features of micro ball grid
array ( BGA) chip scale packaging (CSP) and also flip-chip
and conventional ball grid array (BGA) package structures. The
paper presents the results of computational fluid dynamics (CFD)
models of the early stages of the assembly process when the
adhesive is squeezed out between the device and the substrate.
Experimental results on the assembly trials are presented in an
accompanying paper  and have been previously reported at
the Adhesives in Electronics Conference, Gothenburg, 1996 .
The CFD models outlined here show how those results might be
expected to change for smaller pitches.|
|Description: ||This is a journal article. It was published in the journal IEEE transactions on components, packaging and manufacturing technology - Part C [© IEEE], and is available from: http://ieeexplore.ieee.org/servlet/opac?punumber=3476 . Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Published Articles (Mechanical, Electrical and Manufacturing Engineering)|
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