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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/3784

Title: Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory
Authors: Mannan, Samjid H.
Whalley, David C.
Ogunjimi, Adebayo Oluyinka
Williams, David J.
Keywords: Anisotropic Conductive Adhesive,
Computational Fluid Dynamics
Flip-chip Assembly
Issue Date: 1996
Publisher: © Institute of Electrical and Electronics Engineers (IEEE)
Citation: MANNAN, S. H. ...et al, 1996. Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory. IEEE transactions on components, packaging and manufacturing technology - Part C, 19 (4), pp. 264-269
Abstract: This paper presents new results from an experimental and theoretical program to evaluate relevant process parameters in the assembly of a 500 m pitch area array component using anisotropic conductive adhesive (ACA) materials. This experimental configuration has features of micro ball grid array ( BGA) chip scale packaging (CSP) and also flip-chip and conventional ball grid array (BGA) package structures. The paper presents the results of computational fluid dynamics (CFD) models of the early stages of the assembly process when the adhesive is squeezed out between the device and the substrate. Experimental results on the assembly trials are presented in an accompanying paper [1] and have been previously reported at the Adhesives in Electronics Conference, Gothenburg, 1996 [2]. The CFD models outlined here show how those results might be expected to change for smaller pitches.
Description: This is a journal article. It was published in the journal IEEE transactions on components, packaging and manufacturing technology - Part C [© IEEE], and is available from: http://ieeexplore.ieee.org/servlet/opac?punumber=3476 . Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
URI: https://dspace.lboro.ac.uk/2134/3784
ISSN: 1083-4400
Appears in Collections:Published Articles (Mechanical and Manufacturing Engineering)

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