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|Title: ||Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel plating|
|Authors: ||Hutt, David A.|
Conway, Paul P.
Whalley, David C.
Mannan, Samjid H.
|Keywords: ||Electroless Nickel|
Under Bump Metalization
|Issue Date: ||2002|
|Citation: ||HUTT, D. A. ...et al, 2002. Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel plating. IEEE transactions on components and packaging technologies, 25 (1), pp. 98-105|
|Abstract: ||Electroless nickel has been used for many decades to
provide a hard, corrosion resistant surface finish to engineering
components. In recent years its application has been extended to
the electronics industry for the production of solderable surfaces
on printed circuit boards, which utilize a further thin gold coating
to prevent oxidation of the nickel surface. The recent interest in
the use of flip-chip technology in electronics manufacture has required
the development of low cost methods for solder bumping
of semiconductor wafers. The electroless nickel process has been
considered as a suitable candidate for the deposition of a solderable
under bump metallization (UBM) layer onto the Al bondpads.
However, the extension of existing electroless nickel plating processes
to this new application requires greater understanding of
the technique. In particular, the coating of the small isolated bondpads
on the wafer surface introduces difficulties that make the use
of many commercially available solutions impossible. This paper
reports the results of a number of experiments carried out to investigate
the electroless nickel bumping of Al bondpads and highlights
the issues that need to be considered when selecting materials and
|Description: ||This is a journal article. It was published in the journal IEEE transactions on components, packaging and manufacturing technologies [© IEEE], and is available from: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6144. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Published Articles (Mechanical and Manufacturing Engineering)|
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