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|Title: ||Materials and processes issues in fine pitch eutectic solder flip chip interconnection|
|Authors: ||Liu, Changqing|
Hutt, David A.
Conway, Paul P.
Whalley, David C.
Under Bump Metalization
|Issue Date: ||2006|
|Publisher: ||© Institute of Electrical and Electronics Engineers (IEEE)|
|Citation: ||LIU, C. ...et al, 2006. Materials and processes issues in fine pitch eutectic solder flip chip interconnection. IEEE transactions on components and packaging technologies, 29 (4), pp. 869-876|
|Abstract: ||New product designs within the electronics packaging
industry continue to demand interconnects at shrinking geometry,
both at the integrated circuit and supporting circuit board substrate
level, thereby creating numerous manufacturing challenges.
Flip chip on board (FCOB) applications are currently being driven
by the need for reduced manufacturing costs and higher volume
robust production capability. One of today’s low cost FCOB solutions
has emerged as an extension of the existing infrastructure
for surface mount technology and combines an under bump metallization
(UBM) with a stencil printing solder bumping process, to
generate mechanically robust joint structures with low electrical
resistance between chip and board. Although electroless Ni plating
of the UBM, and stencil printing for solder paste deposition have
been widely used in commercial industrial applications, there still
exists a number of technical issues related to these materials and
processes as the joint geometry is further reduced. This paper reports
on trials with electroless Ni plating and stencil paste printing
and the correlation between process variables in the formation of
bumps and the shear strength of said bumps at different geometries.
The effect of precise control of tolerances in squeegees, stencils
and wafer fixtures was examined to enable the optimization of
the materials, processes, and tooling for reduction of bumping defects.|
|Description: ||This is a journal article. It was published in the journal IEEE transactions on components, packaging and manufacturing technologies [© IEEE], and is available from: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6144. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Published Articles (Mechanical, Electrical and Manufacturing Engineering)|
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