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|Title: ||Solder paste reflow modeling for flip chip assembly|
|Authors: ||Mannan, Samjid H.|
Hutt, David A.
Whalley, David C.
Conway, Paul P.
|Issue Date: ||2000|
|Publisher: ||© IEEE|
|Citation: ||MANNAN, S.H....et al., 2000. Solder paste reflow modeling for flip chip assembly. IN : 3rd Electronics Packaging Technology Conference, (EPTC 2000), 5-7 Dec, pp. 103-9.|
|Abstract: ||Solder paste printing and reflow can provide low cost
techniques producing the solder bumps on flip chips. Solder
paste consists of a dense suspension of solder particles in a
fluid medium (vehicle) that acts as an oxide reducing agent
(flux) during reflow, cleaning the metal surfaces of oxides.
This paper reports on optical observations of paste behaviour
at the small length scales associated with flip chip solder
joints, and attempts to model the process using
Computational Fluid Dynamics (CFD). Comparison of
optical observations and CFD modelling show that the
behaviour of the solder cannot be described simply by
surface tension and viscous flow effects and it is deduced
that oxides are still present on the solder surfaces during the
early stages of reflow. The implications for paste heating
method and solder volume are discussed, and a preliminary
CFD model (based on FIDAP) incorporating the effect of the
oxide layers is presented.|
|Description: ||This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Conference Papers (Mechanical and Manufacturing Engineering)|
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