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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/3926

Title: Solder paste reflow modeling for flip chip assembly
Authors: Mannan, Samjid H.
Wheeler, D.
Hutt, David A.
Whalley, David C.
Conway, Paul P.
Bailey, Chris
Issue Date: 2000
Publisher: © IEEE
Citation: MANNAN, S.H....et al., 2000. Solder paste reflow modeling for flip chip assembly. IN : 3rd Electronics Packaging Technology Conference, (EPTC 2000), 5-7 Dec, pp. 103-9.
Abstract: Solder paste printing and reflow can provide low cost techniques producing the solder bumps on flip chips. Solder paste consists of a dense suspension of solder particles in a fluid medium (vehicle) that acts as an oxide reducing agent (flux) during reflow, cleaning the metal surfaces of oxides. This paper reports on optical observations of paste behaviour at the small length scales associated with flip chip solder joints, and attempts to model the process using Computational Fluid Dynamics (CFD). Comparison of optical observations and CFD modelling show that the behaviour of the solder cannot be described simply by surface tension and viscous flow effects and it is deduced that oxides are still present on the solder surfaces during the early stages of reflow. The implications for paste heating method and solder volume are discussed, and a preliminary CFD model (based on FIDAP) incorporating the effect of the oxide layers is presented.
Description: This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
URI: https://dspace.lboro.ac.uk/2134/3926
ISBN: 0780366441
Appears in Collections:Conference Papers (Mechanical and Manufacturing Engineering)

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