Loughborough University
Browse
RC42.pdf (1.47 MB)

Investigation of a solder bumping technique for flip-chip interconnection

Download (1.47 MB)
online resource
posted on 2008-11-07, 16:56 authored by David HuttDavid Hutt, Daniel G. Rhodes, Paul ConwayPaul Conway, Samjid H. Mannan, David Whalley
Investigation of a solder bumping technique for flip-chip interconnection

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

HUTT, D.A....et al., 1999. Investigation of a solder bumping technique for flip-chip interconnection. IN: 24th International Electronics Manufacturing Technology Symposium, 18-19 Oct., Austin, Texas. pp. 334-342

Publisher

© IEEE

Publication date

1999

Notes

This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISBN

07803-55024

Language

  • en

Usage metrics

    Loughborough Publications

    Exports

    RefWorks
    BibTeX
    Ref. manager
    Endnote
    DataCite
    NLM
    DC