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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/3927

Title: Investigation of a solder bumping technique for flip-chip interconnection
Authors: Hutt, David A.
Rhodes, Daniel G.
Conway, Paul P.
Mannan, Samjid H.
Whalley, David C.
Issue Date: 1999
Publisher: © IEEE
Citation: HUTT, D.A....et al., 1999. Investigation of a solder bumping technique for flip-chip interconnection. IN: 24th International Electronics Manufacturing Technology Symposium, 18-19 Oct., Austin, Texas. pp. 334-342
Description: This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
URI: https://dspace.lboro.ac.uk/2134/3927
ISBN: 07803-55024
Appears in Collections:Conference Papers (Mechanical and Manufacturing Engineering)

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