HUTT, D.A....et al., 1999. Investigation of a solder bumping technique for flip-chip interconnection. IN: 24th International Electronics Manufacturing Technology Symposium, 18-19 Oct., Austin, Texas. pp. 334-342
This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.