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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/3928

Title: IGBT package design for high power aircraft electronic systems
Authors: Sarvar, Farhad
Whalley, David C.
Keywords: Thermal design
Issue Date: 2000
Publisher: © IEEE
Citation: SARVAR, F. and WHALLEY, D.C., 2000. IGBT package design for high power aircraft electronic systems. IN: 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, (ITHERM 2000), May 23 - 26, Las Vegas, Nevada, vol 2, pp. 391-397
Abstract: This paper will discuss the design of semiconductor packages having integrated air cooled heatsinks for use in high power electronic systems. It will demonstrate how simple models of the heat transfer from the heatsink fins, which are based on empirical correlations, may be utilised in combination with either simple analytical models or two dimensional finite difference (FD) models of the heat conduction from the semiconductor die through the multilayer package structure to the base of the fins. These models allow the rapid evaluation of performance under both steady state and transient overload conditions, and can be used to rapidly explore a wide range of design options before selecting candidate layouts for more detailed evaluation using, for example, 3D FD analysis. Wind tunnel experiments, which will also be reported, have been carried out to verify the modelling results for different semiconductor device layouts. These trials demonstrate excellent agreement between the models and experimental results.
Description: This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
URI: https://dspace.lboro.ac.uk/2134/3928
ISBN: 0780359127
Appears in Collections:Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)

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