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|Title: ||Observations of solder paste reflow by means of electrical measurements|
|Authors: ||Mannan, Samjid H.|
Hutt, David A.
Whalley, David C.
Conway, Paul P.
|Issue Date: ||2000|
|Publisher: ||© IEEE|
|Citation: ||MANNAN, S.H....et al., 2000. Observations of solder paste reflow by means of electrical measurements. IN: International Symposium on Electronic Materials and Packaging, (EMAP 2000), 30 Nov.-2 Dec., Hong Kong, pp. 175-180.|
|Abstract: ||This paper presents a method for exploring the changes
occurring at the surfaces of solder particles during the reflow
soldering process. The method involves measuring changes in
electrical resistance of a sample of paste as a function of test
voltage. The results are used to estimate the size and nature of
electrical contact spots between the particles, and how these
depend on temperature and time. The activation energy of the
process responsible for increasing the size of contact spots is
deduced for RA and RMA type fluxes and it is shown that
sintering is not the dominant mechanism for increasing contact
size. These results, together with a programme of CFD studies
are expected to help improve solder paste formulations.|
|Description: ||This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Conference Papers (Mechanical and Manufacturing Engineering)|
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