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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/3974

Title: Tailoring thermal profiles for the reflow of SMD assemblies
Authors: Tang, A.C.T.
Whalley, David C.
Williams, David J.
Issue Date: 1990
Publisher: © IEEE
Citation: TANG, A.C.T., WHALLEY, D.C. and WILLIAMS, D.J., 1990. Tailoring thermal profiles for the reflow of SMD assemblies. IN: Proceedings of the 9th IEEE/CHMT International Symposium, Washington DC, 1-3rd October, pp 77-81. [DOI:10.1109/IEMT9.1990.114984]
Abstract: The aim is to investigate the effects of various types of thermal components (also known as heat thieves/barriers) on the thermal profiles of a printed circuit board (PCB). It is demonstrated that it is practical to apply modeling techniques to the IR reflow soldering process. Results show that the thermal profiles of the PCB can be tailored. This is achieved by surrounding the PCB with different materials, such as copper, alumina, and graphite, in a strip or ring formation. This has the effect of altering the distribution of the thermal properties of the system. Results obtained using the model show that by attaching an alumina strip to the outer edge of the PCB can reduce the temperature differential of the PCB to less than 5°C
Description: This is a conference paper [© IEEE] and is also available online at: http://ieeexplore.ieee.org/servlet/opac?punumber=864 Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
URI: https://dspace.lboro.ac.uk/2134/3974
Appears in Collections:Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)

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