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Title: A comparison of modelling methods for electronic interconnect structures
Authors: Ogunjimi, Adebayo Oluyinka
Whalley, David C.
Williams, David J.
Issue Date: 1993
Publisher: © IEEE
Citation: OGUNJIMI, A.A., WHALLEY, D.C., and WILLIAMS,D.J., 1993. A comparison of modelling methods for electronic interconnect structures. IN: Proceedings of the 43rd Electronic Components and Technology Conference, Orlando, 1-4th June, pp. 871-876. [DOI: 10.1109/ECTC.1993.346750]
Abstract: A comparison has been made between the use of 2-dimensional, axisymmetric and 3-dimensional geometry in the finite element analysis of a die attach assembly using conductive adhesives. The axisymmetric geometry was found to be a good approximation to the 3-dimensional geometry and gave considerable savings in computer resources and human effort. The true effect of the corners of the square die modelled was, however, not reflected in the stress level predicted by both of the more computationally efficient but simplified 2-dimensional and axisymmetric models.
Description: This is a conference paper [© IEEE] and is also available online at: http://ieeexplore.ieee.org/servlet/opac?punumber=1029 Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
URI: https://dspace.lboro.ac.uk/2134/3975
Appears in Collections:Conference Papers (Mechanical and Manufacturing Engineering)

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