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A simplified model of the reflow soldering process
online resource
posted on 2008-11-13, 15:07 authored by David WhalleyPrevious models of the reflow soldering process have used
commercial finite difference (FD) or computational fluid
dynamics simulation software to create detailed
representations of the product and/or the reflow furnace. Such
models have been shown to be highly accurate at predicting
the temperatures a PCB design will achieve during the reflow
process. These models are however complex to generate and
analysis times are long, even using modern high performance
workstations. With the move to adopt lead free soldering
technology, and the consequently higher reflow process
temperatures, optimisation of the reflow profile is gaining a
renewed emphasis. This paper describes a less complex
approach to modelling of the process, which uses simplified
representations of both the product and the process, together
with a FD solver developed specifically for this application,
and which achieves an accuracy comparable with more
detailed models. In order to establish an accurate
representation of the specific reflow furnace being simulated,
a reflow logger is used to make measurements of the
temperature and level of thermal convection at each point
along the length of the furnace for a small number of carefully
chosen reflow profiles. The temperatures for any other reflow
profile can then be predicted from these measurements.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Citation
WHALLEY, D.C., 2002. A simplified model of the reflow soldering process. IN: 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, (ITHERM 2002), May 30 - June 1, San Diego, California, pp. 840-847Publisher
© IEEEPublication date
2002Notes
This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.ISBN
0780371526Language
- en