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Title: Reflow soldering process simulation: a simplified model
Authors: Whalley, David C.
Issue Date: 2002
Publisher: © IEEE
Citation: WHALLEY, D.C., 2002. Reflow soldering process simulation: a simplified model. IN: 25th International Spring Seminar on Electronics Technology, May 11 – 14, Prague, pp. 323-328
Abstract: Established models of temperature development during reflow soldering have used general purpose, finite difference (FD) or computational fluid dynamics modelling tools to create detailed representations of both the product and the reflow furnace. Such models have been shown to achieve a high degree of accuracy, but are complex to generate and analysis times are long. With the move to adopt lead free soldering technology, and the consequently higher reflow process temperatures, optimisation of the reflow profile will gain a renewed emphasis. This paper will report a model of the process which uses simplified representations of both the product and the process which achieves an accuracy comparable with more detailed models. In order to establish an accurate representation of the specific reflow furnace being simulated, a reflow logger is used to make measurements of the temperature and level of thermal convection at each point along the length of the furnace for a small number of carefully chosen reflow profiles. The behaviour for any other reflow profile may then be extrapolated from these measurements.
Description: This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
URI: https://dspace.lboro.ac.uk/2134/3979
ISBN: 0780398246
Appears in Collections:Conference Papers (Mechanical and Manufacturing Engineering)

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