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|Title: ||Application of adhesives in MEMS and MOEMS assembly: a review|
|Authors: ||Sarvar, Farhad|
Hutt, David A.
Whalley, David C.
|Issue Date: ||2002|
|Publisher: ||© IEEE|
|Citation: ||SARVAR, F., HUTT, D.A. and WHALLEY, D.C., 2002. Application of adhesives in MEMS and MOEMS assembly: a review. IN: 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, (POLYTRONIC 2002), June 23-26, Zalaegerszeg, Hungary, pp. 22 - 28.|
|Abstract: ||This paper presents a review of the recent literature on the use of adhesives in MEMS packaging applications. The aim of this review has been to establish the current applications of adhesives in MEMS and MOEMS assembly and to investigate the limitations and future requirements of these materials. The review has shown that while there is a wealth of information available on the packaging of MEMS devices, there is very limited detail available within the public domain regarding the specific uses of adhesives and in particular exactly which products are in use. The paper begins with an overview of the uses of adhesives in MEMS packaging, subdivided into sections on structural adhesives, adhesives for optical applications and other applications. The paper then describes methods for adhesive dispensing and issues with adhesive use which affect the reliability of the package. The reliability of MEMS devices assembled using adhesives is a challenging issue, being more than a simple combination of electrical, mechanical and material reliability. Many failure modes in MEMS devices can be attributed to the adhesives used in the assembly; for example, thermal expansion mismatches can cause stress in the die attach, while outgassing from epoxies can cause failure of sealed devices and contamination of optical surfaces.|
|Description: ||This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Conference Papers and Contributions (Mechanical, Electrical and Manufacturing Engineering)|
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