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|Title: ||Thermal stress analysis of conductive adhesive joints|
|Authors: ||Ogunjimi, Adebayo Oluyinka|
Whalley, David C.
Williams, David J.
|Issue Date: ||1993|
|Publisher: ||© IEEE|
|Citation: ||OGUNJIMI, A.A., WHALLEY, D.C., and WILLIAMS, D.J., 1993. Thermal stress analysis of conductive adhesive joints. IN: Proceedings of the Japan International Electronic Manufacturing Technology Symposium, Kanazawa, 9-11th June, pp. 349-353.|
|Abstract: ||The effect of die geometry and the bond layer
thickness on the stress distribution in a conductive
die attach assembly was analysed using finite element
models. Models used for the analysis were those of a
freely deforming assembly i.e. not restrained by
packaging. It was found that the thinner the bondline,
the greater the stress in the joint. The level of stress in
the joint remains approximately constant for die sizes
greater than (4x4)" and a sawn through die was
found to be much better for stress management.|
|Description: ||This is a conference paper [© IEEE] and is also available online at: http://ieeexplore.ieee.org/servlet/opac?punumber=5087 Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)|
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