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Title: Thermal stress analysis of conductive adhesive joints
Authors: Ogunjimi, Adebayo Oluyinka
Whalley, David C.
Williams, David J.
Issue Date: 1993
Publisher: © IEEE
Citation: OGUNJIMI, A.A., WHALLEY, D.C., and WILLIAMS, D.J., 1993. Thermal stress analysis of conductive adhesive joints. IN: Proceedings of the Japan International Electronic Manufacturing Technology Symposium, Kanazawa, 9-11th June, pp. 349-353.
Abstract: The effect of die geometry and the bond layer thickness on the stress distribution in a conductive die attach assembly was analysed using finite element models. Models used for the analysis were those of a freely deforming assembly i.e. not restrained by packaging. It was found that the thinner the bondline, the greater the stress in the joint. The level of stress in the joint remains approximately constant for die sizes greater than (4x4)" and a sawn through die was found to be much better for stress management.
Description: This is a conference paper [© IEEE] and is also available online at: http://ieeexplore.ieee.org/servlet/opac?punumber=5087 Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
URI: https://dspace.lboro.ac.uk/2134/3982
ISBN: 0780314328
Appears in Collections:Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)

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