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Thermal stress analysis of conductive adhesive joints
journal contribution
posted on 2008-11-13, 15:14 authored by Adebayo Oluyinka Ogunjimi, David Whalley, David WilliamsThe effect of die geometry and the bond layer
thickness on the stress distribution in a conductive
die attach assembly was analysed using finite element
models. Models used for the analysis were those of a
freely deforming assembly i.e. not restrained by
packaging. It was found that the thinner the bondline,
the greater the stress in the joint. The level of stress in
the joint remains approximately constant for die sizes
greater than (4x4)" and a sawn through die was
found to be much better for stress management.
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School
- Mechanical, Electrical and Manufacturing Engineering