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|Title: ||Modelling of the initial stages of the anisotropic adhesive joint assembly process|
|Authors: ||Mannan, Samjid H.|
Whalley, David C.
Ogunjimi, Adebayo Oluyinka
Williams, David J.
|Issue Date: ||1995|
|Publisher: ||© IEEE|
|Citation: ||MANNAN, S.H. ... et al, 1995. Modelling of the initial stages of the anisotropic adhesive joint assembly process. IN: Proceedings of the 1995 Japan International Electronic Manufacturing Technology Symposium, Omiya, 4-6th December, pp. 142-145. [DOI: 10.1109/IEMT.1995.541013]|
|Abstract: ||Industrial experience and academic studies to date indicate the initial stages of the assembly process for anisotropic adhesive joints are particularly significant to the successful formation and long term performance of the completed assembly. The consistency of the process is controlled by the early stages of compression and the resulting distribution of conducting particles is affected by the adhesive resin flow in the early stages of the assembly process. The bump geometry on flip chip assemblies has been found to be critical to the success of the process as it significantly affects the early stages of the adhesive film compression. This paper describes analytical and CFD models which explore the time required to squeeze out the adhesive as a function of applied pressure, temperature ramp rate, and adhesive viscosity. The results of a study on adhesive rheology are presented and used in the flow models. The paper also explores the flow of conducting particles within the adhesive, and hence the final particle distribution underneath the flip chip. This distribution has been shown in the past to significantly affect the probabilities of shorts and opens|
|Description: ||This is a conference paper [© IEEE] and is also available online at: http://ieeexplore.ieee.org/servlet/opac?punumber=4032 Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)|
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