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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/4102

Title: Automated adaptive control of the reflow soldering of electronic assemblies
Authors: Conway, Paul P.
Whalley, David C.
Wilkinson, M.
Williams, David J.
Keywords: Adaptive control
Assembling
Infrared detectors
Printed circuit manufacture
Process control
Reflow soldering
Issue Date: 1997
Publisher: © IEEE
Citation: CONWAY, P.P.... et al., 1997. Automated adaptive control of the reflow soldering of electronic assemblies. IN : Twenty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin TX, 13-15 Oct. pp.229 - 236.
Abstract: This paper describes a new technique for the monitoring and automated control of the reflow soldering process. The new technique combines state of the art infra-red (IR) sensor technology, coupled with application specific process control software, to provide a unique capability to both monitor actual product temperatures during the soldering process and to use this information to modify the process settings. The development of techniques to allow rapid variation of the heat transfer from the oven to the in-process Printed Circuit Assemblies (PCAs) allows the system to automatically adjust the soldering oven's process settings for each individual PCA passing through it. This product-by-product profiling facilitates the assurance of consistent thermal histories and also allows the oven to optimise its energy consumption to the demands of each product. Archiving of the reflow temperature profiles also provides full traceability to the reflow process. The incorporation of IR sensing technology also aids in determining/verifying the oven profile at the introduction of new PCA designs. This paper presents an overview of the construction and operation of the system and outlines the technical challenges that have been met and overcome.
Description: This is a conference paper [© IEEE] and is also available online at: http://ieeexplore.ieee.org/servlet/opac?punumber=4943 Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Version: Published
DOI: 10.1109/IEMT.1997.626923
URI: https://dspace.lboro.ac.uk/2134/4102
ISSN: 0780339290
Appears in Collections:Conference Papers (Mechanical and Manufacturing Engineering)

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